کد مقاله | کد نشریه | سال انتشار | مقاله انگلیسی | نسخه تمام متن |
---|---|---|---|---|
1667559 | 1008852 | 2012 | 5 صفحه PDF | دانلود رایگان |
عنوان انگلیسی مقاله ISI
Source/drain junction fabrication for Ge metal-oxide-semiconductor field-effect transistors
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موضوعات مرتبط
مهندسی و علوم پایه
مهندسی مواد
فناوری نانو (نانو تکنولوژی)
پیش نمایش صفحه اول مقاله
چکیده انگلیسی
We established fabrication methods for high-quality Ge n+/p and p+/n junctions using thermal diffusion of P and implantation of B, respectively. The carrier concentrations in n+ and p+ layers were as high as 4 Ã 1019 and 2 Ã 1019 cmâ 3, respectively. It was found that a peripheral surface-state current dominates the reverse leakage current in an n+/p junction diode. The protection of junction surfaces from plasma damage during the SiO2 deposition was essential to achieve high-quality source/drain junctions. The surface passivation with a GeO2 interlayer was harmful to an n-channel metal-oxide-semiconductor field-effect transistor (MOSFET) because of an increase in a surface leakage current due to inversion carriers. For a p-channel MOSFET, on the other hand, the GeO2 interlayer plays a role in decreasing the surface leakage current.
ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Thin Solid Films - Volume 520, Issue 8, 1 February 2012, Pages 3382-3386
Journal: Thin Solid Films - Volume 520, Issue 8, 1 February 2012, Pages 3382-3386
نویسندگان
Keisuke Yamamoto, Takeshi Yamanaka, Ryuji Ueno, Kana Hirayama, Haigui Yang, Dong Wang, Hiroshi Nakashima,