Role of environmental and annealing conditions on the passivation-free in-Ga–Zn–O TFT

We examined the characteristics of passivation-free amorphous In–Ga–Zn–O thin film transistor (a-IGZO TFT) devices under different thermal annealing atmospheres. With annealing at higher temperature, the device performed better at the above-threshold operation region, which indicated the film quality was improved with the decrease of defects in the a-IGZO active region. The mobility, threshold voltage and subthreshold swing of a-IGZO TFT annealed at 450 °C was 7.53 cm2/V s, 0.71 V and 0.18 V/decade, respectively. It was also observed that the a-IGZO was conductive after thermal annealing in the vacuum, due to the ease of oxygen out-diffusion from the a-IGZO back channel. The oxygen deficiency resultantly appeared, and provided leaky paths causing electrical unreliability when TFT was turned off. In contrast, the annealing atmosphere full of O2 or N2 would suppress the oxygen diffusion out of the a-IGZO back channel. The worst Vth degradation of a-IGZO TFT after positive gate bias stress and negative gate bias stress (NGBS) was about 2 V and − 2 V, respectively. However, the Vth shift in the NGBS testing could be suppressed to − 0.5 V in vacuum chamber. Material analysis methods including X-ray photoelectron spectroscopy and scanning electron microscopy were used to investigate the change of a-IGZO film after different thermal annealing treatments. The variation of O 1s spectra with different annealing atmospheres showed the consistence with our proposed models.