Characteristics of SiOx thin films deposited by atmospheric pressure chemical vapor deposition as a function of HMDS/O2 flow rate

SiO2-like thin films were deposited using a modified dielectric barrier discharge with a gas mixture of hexamethyldisilazane (HMDS)/O2/He/Ar and their film characteristics were investigated as functions of the HMDS and O2 flow rates. As the HMDS flow rate was increased, higher amounts of Si–(CH3)x bonds and lower amounts of Si–OH bonds were observed in the deposited SiOx, due to the increase in the amount of the less dissociated HMDS, which also caused an increase of the surface roughness. The addition and increase of the oxygen flow to HMDS/He/Ar brought the stoichiometry of SiOx close to SiO2 and decreased the surface roughness by decreasing the amount of Si–(CH3)x bonds through the increased decomposition and oxidation of HMDS, even though the deposition rate was decreased. However, when the O2 flow rate was higher than a certain threshold, the surface roughness increased again, possibly due to the decrease in the extent of HMDS dissociation caused by the decreased plasma density at the higher oxygen flow rate. By using an optimized gas mixture of HMDS (150 sccm)/O2 (14 slm)/He (5 slm)/Ar (3 slm), SiO2-like thin films with a very low impurity level and having a smooth surface could be obtained with a deposition rate of approximately 42.7 nm/min.