Effect of bromide ions and polyethylene glycol on morphological control of electrodeposited copper foam

Three-dimensional porous copper foam was fabricated through acid copper electrodeposition under intense hydrogen evolution at an extremely high current density. Bromide ions and polyethylene glycol (PEG) were employed as additives to investigate their effects on the morphology and the microstructure of the foam. As bromide was added, the surface pore size and the thickness of the foam were increased. It also made the wall structure become more compact, and transformed the particles into a more dendritic form. On the other hand, PEG changed the foam in a completely opposed direction. Additionally, the simultaneous effect of the additives was studied. It was indicated that to a large extent the two additives functioned independently on the morphology and the microstructure, but they also developed a synergetic effect on the formation of CuBr.