کد مقاله | کد نشریه | سال انتشار | مقاله انگلیسی | نسخه تمام متن |
---|---|---|---|---|
1671927 | 1008926 | 2009 | 6 صفحه PDF | دانلود رایگان |
عنوان انگلیسی مقاله ISI
Electron microscopy of geometrically confined copper thin films after rapid lateral solidification
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کلمات کلیدی
موضوعات مرتبط
مهندسی و علوم پایه
مهندسی مواد
فناوری نانو (نانو تکنولوژی)
پیش نمایش صفحه اول مقاله
![عکس صفحه اول مقاله: Electron microscopy of geometrically confined copper thin films after rapid lateral solidification Electron microscopy of geometrically confined copper thin films after rapid lateral solidification](/preview/png/1671927.png)
چکیده انگلیسی
We have used transmission electron microscopy and scanning electron microscopy to study the microstructure in polycrystalline 200 nm thick copper thin films that are geometrically confined between transparent amorphous silicon oxide layers after single pulse laser melting and rapid lateral solidification (RLS). The microstructure consisted predominantly of directionally solidified grains with an in-plane columnar structure and dimensions of up to 22 μm long and about 1 μm wide. A <100> preferred orientation in the vicinity of the average growth direction in the thin film plane has been identified for these high aspect ratio columnar grains produced by RLS in this Cu thin film12.
ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Thin Solid Films - Volume 517, Issue 13, 1 May 2009, Pages 3629–3634
Journal: Thin Solid Films - Volume 517, Issue 13, 1 May 2009, Pages 3629–3634
نویسندگان
A. Kulovits, R. Zhong, J.M.K. Wiezorek, J.P. Leonard,