کد مقاله کد نشریه سال انتشار مقاله انگلیسی نسخه تمام متن
1672805 1008939 2009 6 صفحه PDF دانلود رایگان
عنوان انگلیسی مقاله ISI
Electrical properties of electroplated Cu(Ag) thin films
موضوعات مرتبط
مهندسی و علوم پایه مهندسی مواد فناوری نانو (نانو تکنولوژی)
پیش نمایش صفحه اول مقاله
Electrical properties of electroplated Cu(Ag) thin films
چکیده انگلیسی

To increase the electromigration resistance of copper interconnects copper alloy systems are of interest. In the present paper electrical properties of Cu(Ag) films will be discussed with respect to heat treatment and in comparison to copper and other alloy systems. The investigations show that the electrical resistivity of Cu(Ag) films is very low in comparison to other copper alloy systems. Up to an alloy content of about 2 at.% Ag the International Technology Roadmap for Semiconductors criterion of 2.2 μΩcm (scattering by geometrical constraints neglected) can be fulfilled after heat treatment. The various components of the electrical resistivity will be discussed in detail. The investigations show that grain growth and the redistribution of silver and impurities dominate the electrical resistivity evolution.

ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Thin Solid Films - Volume 517, Issue 11, 2 April 2009, Pages 3320–3325
نویسندگان
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