کد مقاله | کد نشریه | سال انتشار | مقاله انگلیسی | نسخه تمام متن |
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1673016 | 1518087 | 2007 | 6 صفحه PDF | دانلود رایگان |
The structure and distribution of misfit dislocations at Cu–Ni interfaces and their effects on the tribological behavior of a Ni film are investigated with 3D Molecular Dynamic Simulations. The structure of misfit dislocation network at a Cu–Ni interface differs according to different crystallographic orientations of the film relative to the substrate: a triangle and square type of misfit dislocation network are observed at (111)Cu||(111)Ni and (001)Cu||(001)Ni interfaces respectively. They play an important role in the strengthening of Cu/Ni multilayers. During the scratching of a single asperity contact on the Ni film, the misfit dislocation network becomes a significant barrier to the glide dislocations. The plot of friction force vs. normal load when scratching on the Ni film exhibits a horizontal stage, representing the decreasing of the frictional coefficient due to the existence of the misfit dislocations network.
Journal: Thin Solid Films - Volume 515, Issues 7–8, 26 February 2007, Pages 3698–3703