کد مقاله | کد نشریه | سال انتشار | مقاله انگلیسی | نسخه تمام متن |
---|---|---|---|---|
1674965 | 1008972 | 2008 | 5 صفحه PDF | دانلود رایگان |
عنوان انگلیسی مقاله ISI
Study of Cu emergence on the surface of TaN-Cu nanocomposite thin films and its effects on tribological property
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موضوعات مرتبط
مهندسی و علوم پایه
مهندسی مواد
فناوری نانو (نانو تکنولوژی)
پیش نمایش صفحه اول مقاله
![عکس صفحه اول مقاله: Study of Cu emergence on the surface of TaN-Cu nanocomposite thin films and its effects on tribological property Study of Cu emergence on the surface of TaN-Cu nanocomposite thin films and its effects on tribological property](/preview/png/1674965.png)
چکیده انگلیسی
TaN-Cu nanocomposite films, were deposited by reactive co-sputtering on Si and tool steel substrates. The films were then annealed using RTA (Rapid Thermal Annealing) at 400 °C for 2, 4, 8 min respectively to induce the nucleation and growth of Cu particles in the TaN matrix and on the film surface. SSPM (Scanning Surface Potential Microscopy) and SEM (Scanning Electron Microscopy) were applied to examine the Cu nano-particles that emerged on the surface of TaN-Cu thin films. Pin-on-Disk tribometer was used to study the effect of annealing on the films' tribological properties. The results reveal that annealing by RTA can cause Cu nano-particles to emerge on the TaN surface. Consequently, hardness and friction coefficients will change depending on annealing conditions, Cu content, and/or Cu particle emergence.
ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Thin Solid Films - Volume 516, Issue 16, 30 June 2008, Pages 5430-5434
Journal: Thin Solid Films - Volume 516, Issue 16, 30 June 2008, Pages 5430-5434
نویسندگان
J.H. Hsieh, M.K. Cheng, C. Li, S.H. Chen, Y.G. Chang,