Effect of substrate on the nucleation and growth of aluminum films deposited from methylpyrrolidine alane

Methylpyrrolidine alane complex was used to deposit aluminum films on various types of substrates in a low pressure chemical vapor deposition reactor. The films grow easily on metallic and transition metal oxide surfaces, but not on any other tested semiconductor and dielectric substrates below 200 °C, showing strong substrate dependency. The free energies of precursor adsorption, surface dissociation reaction and product desorption, as well as the film wettability to substrate are among the key factors which affect the energy barrier for nucleation or deposition selectivity. In general, a metal substrate can enhance nucleation because it catalyzes the surface reactions and bonds strongly with aluminum. The oxidation-reduction reaction may occur between the precursor and substrate on a metal oxide surface. The reduced metal sites can be the seed nuclei and are possibly responsible for Al growth on the surfaces of transition metal oxides.