Texture evolution in Copper film at high temperature studied in situ by electron back-scatter diffraction

Changes in texture and microstructure during the thermal treatment of Cu films have been studied in situ using electron back-scatter diffraction (EBSD). A partially recrystallized Cu film which still had its microstructure evolving at room temperature was investigated using orientation imaging microscopy. Two separate investigations were conducted—the first one at different locations of the film and at different temperatures and a second one at the same location of the film and at different temperatures. The orientation of the (111), (110) and (100) grains within the plane of Cu film was investigated from the orientation distribution functions. There was an increased tendency of the (111) and (110) grains to form either {111}<112> or {111}<110> and {110}<100> texture respectively at higher temperature. The impact of elastic strain energies and dislocation glide in formation of these textures at higher temperatures has been analyzed in the light of some recent observations reported in literature. The variation in the area fraction of different fiber texture components, as a function of temperature, has been discussed in correlation with the measured mean grain size, grain boundary misorientation distribution and stress states. Stress state during the entire thermal cycle was monitored by wafer curvature technique and the traces of additive impurities at the surface were measured using X-ray photoelectron spectrometry. The possible role of impurities in affecting the behavior of texture components at high temperature is discussed. Comparison was made between the EBSD and X-ray diffraction texture data.