کد مقاله | کد نشریه | سال انتشار | مقاله انگلیسی | نسخه تمام متن |
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1677215 | 1518105 | 2006 | 6 صفحه PDF | دانلود رایگان |
The processing–structure–property relationship is investigated for electrodeposited foils of the gold–copper alloy system. A model is presented that relates the deposition process parameters to the nanocrystalline grain size. An activation energy of 1.52 eV atom− 1 for growth is determined for a long-pulse (> 10 msec) mode, and is 0.16 eV atom− 1 for short pulses (< 5 msec). The effect of nanocrystalline grain size on the mechanical properties is assessed using indentation measurements. A Hall–Petch type variation of the Vickers microhardness with nanocrystalline grain size (> 6 nm) is observed for Au–Cu samples with 1–12 wt.% Cu as tested in cross-section. The hardness increases three-fold from a rule-of-mixtures value < 1 GPa to a maximum of 2.9 GPa.
Journal: Thin Solid Films - Volume 494, Issues 1–2, 3 January 2006, Pages 268–273