A scalable anti-sticking layer process via controlled evaporation

• Controlled deposition of anti-sticking layers based on the use of evaporation cell.
• Tuning of process time and uniformity by multiple-cell arrangement.
• Uniformity of surface energy better than ±4% over 100 mm diameter.
• Low surface energy (≈10–15 mN/m) obtained after 40 min at 120 °C.

We developed a novel process for the deposition of anti-sticking layers from the gas phase based on the use of evaporation cells. The cells are prepared from Teflon and consist of small silane containers with an orifice. Temperature is used to provide a silane-containing gas phase in the containers; the temperature is well below the boiling point of the silane. The number of cells can be varied to improve the uniformity with respect to surface energy, to scale-up the process to larger diameters and to reduce the processing time required. The impact of cell number, processing temperature and processing time is investigated with respect to uniformity and with respect to the minimum times and temperatures required. The concept works well and shows potential for the control of surface energy beyond anti-sticking purposes.

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