Electrochemical fabrication of platinum interconnects for implantable electronic devices

• Pt interconnects were electrodeposited on flexible biocompatible substrates.
• Galvanostatic deposition method was optimized for up-scaling.
• As-plated Pt met the application requirements, except for resistivity.
• Post-plating anneal at temperature ⩽375 °C was enough to satisfy requirements.
• Successful fabrication of Pt lines on a flexible medical grade polyimide.

In this paper we report on fabrication of Platinum (Pt) interconnects on the flexible bio-compatible substrates, having in mind possible applications in implantable medical devices. We aim to replace physical vapor deposition methods (PVD) with plating in cases when this is cost effective, i.e. when only a small fraction of the substrate needs to be coated with Pt. We optimize plating parameters by doing tests on coupons, and then explore up-scaling the process to 2 inch wafers and larger substrates/carriers covered with releasable polyimide layers. Physical and chemical properties of deposited lines are assessed, and post-plating steps developed so that characteristics of electrochemically deposited (ECD) Pt match those of PVD Pt.

Figure optionsDownload as PowerPoint slide