کد مقاله کد نشریه سال انتشار مقاله انگلیسی ترجمه فارسی نسخه تمام متن
5432990 1398051 2017 12 صفحه PDF سفارش دهید دانلود کنید
عنوان انگلیسی مقاله ISI
Mechanical and microbiological properties and drug release modeling of an etch-and-rinse adhesive containing copper nanoparticles
ترجمه فارسی عنوان
خواص مکانیکی و میکروبیولوژیکی و مدل سازی آزادی دارو از یک چسب مصنوعی و چسبنده حاوی نانوذرات مس
کلمات کلیدی
موضوعات مرتبط
مهندسی و علوم پایه مهندسی مواد بیومتریال
چکیده انگلیسی


- Copper nanoparticles were characterized and added in different concentrations to etch-and-rinse adhesive.
- Addition of copper nanoparticles did not affect several mechanical properties tested.
- Higher concentrations of copper nanoparticles produce more resistance adhesive-dentin interfaces.
- Copper nanoparticles significant increase the antimicrobial activity.

ObjectivesTo evaluate the effect of addition of copper nanoparticles (CN) at different concentrations into a two-step etch-and-rinse (2-ER) adhesive on antimicrobial activity (AMA), copper release (CR), ultimate tensile strength (UTS), degree of conversion (DC), water sorption (WS), solubility (SO), as well as the immediate (IM) and 1-year resin-dentin bond strength (μTBS) and nanoleakage (NL).MethodsSeven adhesives were formulated according to the addition of CN (0, 0.0075, 0.015, 0.06, 0.1, 0.5 and 1 wt%) in adhesive. The AMA was evaluated against Streptococcus mutans using agar diffusion assay. For CR, WS and SO, specimens were constructed and tested for 28 days. For UTS, specimens were tested after 24 h and 28 days. For DC, specimens were constructed and tested after 24 h by FTIR. After enamel removal, the ER was applied to dentin. After composite resin build-ups, specimens were sectioned to obtain resin-dentin sticks. For μTBS and NL, specimens were tested after 24 h and 1-year periods. All data were submitted to statistical analysis (α = 0.05).ResultsThe addition of CN provided AMA to the adhesives at all concentrations. Higher CR was observed in adhesives with higher concentration of CN. UTS, DC, WS and SO were not influenced. For μTBS an increase was observed in 0.1 and 0.5% copper group. For NL, a significant decrease was observed in all groups in comparison with control group. After 1-year, no significant reductions of μTBS and no significant increases of NL were observed for copper containing adhesives compared to the control group.SignificanceThe addition of CN in concentrations up to 1 wt% in the 2-ER adhesive may be an alternative to provide AMA and preserve the bonding to dentin, without reducing adhesives' mechanical properties evaluated.

ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Dental Materials - Volume 33, Issue 3, March 2017, Pages 309-320
نویسندگان
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