کد مقاله | کد نشریه | سال انتشار | مقاله انگلیسی | نسخه تمام متن |
---|---|---|---|---|
8032502 | 1517951 | 2018 | 4 صفحه PDF | دانلود رایگان |
عنوان انگلیسی مقاله ISI
Polycrystalline-silicon thin-film transistor fabricated with Cu gate controlled morphology by plating mode
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موضوعات مرتبط
مهندسی و علوم پایه
مهندسی مواد
فناوری نانو (نانو تکنولوژی)
پیش نمایش صفحه اول مقاله
چکیده انگلیسی
A planarized copper gate thin-film transistor (TFT) using metal-induced laterally-crystallized polycrystallineâsilicon (poly-Si) was fabricated and characterized in this study. The planarized copper gate was able to structurally alleviate the drawbacks of copper and enhance stability to adapt in TFTs. Moreover, the surface of copper was systematically investigated by an electroplating process involving leveling additives such as thiourea and chloride in acidic sulphate-plating baths. These additives can improve surface morphology and ensure a smoother surface of the copper gate, which influence the electrical property of poly-Si TFT while reducing the surface roughness scattering effect. As the gate surface morphology was enhanced, the device exhibited superior electrical characteristics in field-effect mobility, on/off current ratio, and subthreshold slope.
ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Thin Solid Films - Volume 661, 1 September 2018, Pages 128-131
Journal: Thin Solid Films - Volume 661, 1 September 2018, Pages 128-131
نویسندگان
Hee Jae Chae, Kyung Yup Song, Seung Ki Joo,