کد مقاله | کد نشریه | سال انتشار | مقاله انگلیسی | نسخه تمام متن |
---|---|---|---|---|
8032584 | 1517952 | 2018 | 28 صفحه PDF | دانلود رایگان |
عنوان انگلیسی مقاله ISI
Sequential interfacial reactions of Au/In/Au transient liquid phase-bonded joints for power electronics applications
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کلمات کلیدی
موضوعات مرتبط
مهندسی و علوم پایه
مهندسی مواد
فناوری نانو (نانو تکنولوژی)
پیش نمایش صفحه اول مقاله
چکیده انگلیسی
The transient liquid phase (TLP) bonding of Au/In/Au as a die-attach material for high-temperature applications was studied in this work. The sequential interfacial reactions between Au and In layers and the phase transformations of an In solder to the intermetallic compound (IMC) phases of the Au/In/Au joints were investigated for TLP bonding at 190â¯Â°C for up to 30â¯min under different bonding pressures (0.2-10â¯MPa). The TLP joint was fully converted into the Au-rich Au7In3 IMC. During TLP bonding, the In solder was sequentially transformed in the following order: I (Au7In3, AuIn, and AuIn2), II (Au7In3 and AuIn), and III (Au7In3). We effectively fabricated the Au/In/Au TLP-bonded joint under moderate bonding pressures of 5 and 10â¯MPa for a short bonding time.
ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Thin Solid Films - Volume 660, 30 August 2018, Pages 618-624
Journal: Thin Solid Films - Volume 660, 30 August 2018, Pages 618-624
نویسندگان
Jeong-Won Yoon, Byung-Suk Lee,