کد مقاله | کد نشریه | سال انتشار | مقاله انگلیسی | نسخه تمام متن |
---|---|---|---|---|
8033489 | 1517994 | 2016 | 7 صفحه PDF | دانلود رایگان |
عنوان انگلیسی مقاله ISI
Improved thermal stability and reliability of Cu film electrode induced by bias magnetron sputtering
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کلمات کلیدی
موضوعات مرتبط
مهندسی و علوم پایه
مهندسی مواد
فناوری نانو (نانو تکنولوژی)
پیش نمایش صفحه اول مقاله

چکیده انگلیسی
The performance degradation of the thin-film electrodes has remained a challenge for the whole performance of micro-devices. Here, we introduce substrate bias voltage (SBV) in magnetron sputtering technique to improve the thermal stability and reliability of copper (Cu) electrode. The effects of the SBV on the stability and reliability of Cu film electrodes were investigated by scanning electron microscopy and thermal shock. Unstable electric performance is suppressed, and the interface bonding strength between the film and substrate is obviously improved by applying SBV. In addition, this work provides a facile way to achieve high reliability and thermal stability for Cu electrodes used in various thin-film devices.
ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Thin Solid Films - Volume 616, 1 October 2016, Pages 562-568
Journal: Thin Solid Films - Volume 616, 1 October 2016, Pages 562-568
نویسندگان
Yuncheng Peng, Yuan Deng, Yao Wang, Shengfei Shen,