کد مقاله | کد نشریه | سال انتشار | مقاله انگلیسی | نسخه تمام متن |
---|---|---|---|---|
8033707 | 1518006 | 2016 | 9 صفحه PDF | دانلود رایگان |
عنوان انگلیسی مقاله ISI
Two-step flash light sintering process for enhanced adhesion between copper complex ion/silane ink and a flexible substrate
ترجمه فارسی عنوان
فرایند پخت دو مرحله ای فلاش برای افزایش چسبندگی میان جوهر یون / سیلاان مس و یک بستر انعطاف پذیر
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کلمات کلیدی
روش پخت دو مرحله ای، اسپری فلش نور، نانوذرات مس، پیش ماده مس، چسبندگی، پلاسما اکسیژن،
موضوعات مرتبط
مهندسی و علوم پایه
مهندسی مواد
فناوری نانو (نانو تکنولوژی)
چکیده انگلیسی
A copper complex ion ink (including copper nanoparticles, a copper precursor and a silane coupling agent) was synthesized to enhance the adhesion between the copper pattern and a polyimide (PI) substrate. Oxygen plasma treatment was performed on the polyimide substrate to initiate a chemical reaction between the complex ion ink and the polyimide. Then, a two-step flash light sintering method (consisting of preheating and main sintering) was used to sinter the copper complex ion ink. The copper complex ion patterns were characterized as a function of the weight fraction of silane coupling agent using scanning electron microscopy (SEM), a four-point probe method and adhesion testing. In addition, a bending fatigue test was performed to evaluate the reliability of the conductive copper pattern under cyclic bending. The copper pattern fabricated with copper complex ion ink containing 3 wt% silane coupling agent exhibited the highest adhesion level (5B), the lowest resistivity (7.6 μΩ·cm) and a low resistance change (18%) after the bending fatigue test. The two-step sintering method used to enhance the adhesion between the copper complex ion ink and polyimide substrate was also studied using X-ray diffraction (XRD) and Fourier transform infrared spectroscopy (FT-IR).
ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Thin Solid Films - Volume 603, 31 March 2016, Pages 382-390
Journal: Thin Solid Films - Volume 603, 31 March 2016, Pages 382-390
نویسندگان
Eun-Beom Jeon, Sung-Jun Joo, Heejoon Ahn, Hak-Sung Kim,