Formation of submicron buckling patterns in thin metal film on micro-scale substrate by pyrolysis of photoresist

A method for fabricating micro-scale structure with submicron buckling pattern on the surface is proposed. In the fabrication, photoresist substrate is prepared using photolithography; a metal film with specified thickness is sputtered on the substrate. Then the photoresist micro-structure is pyrolyzed. During the pyrolysis, the micro-structure shrinks, and compressive stress is created in the metal film. When the compressive stress exceeds a critical value, the metal film buckles and various patterns appear. The influence of process parameters on the morphology, wavelength, and amplitude of the buckling pattern is investigated, and the mechanism of buckling is discussed based on the experiment results.