An elevated temperature study of a Ti adhesion layer on polyimide

► The influence of temperature on cracking and buckling of a Ti/polyimide (PI) system is reported. ► The interfacial adhesion is found to reduce by a factor 3 following heating to 350 °C. ► An interlayer was observed in unheated samples at the Ti/PI interface. ► Phase separation of the interlayer is a likely cause of adhesion reduction.