A chemical kinetics model for a mixed-abrasive chemical mechanical polishing

In this article, a chemical kinetics mechanism was proposed for the chemical mechanical polishing (CMP) system of mixed-abrasive slurry. Under the consideration of a pad as a sort of catalyst, a polishing rate equation was deduced. Compared to the previous equations, the present equation is in terms of the abrasive concentration. With the limited experimental data, the present equation may work for describing the CMP mechanism.