کد مقاله کد نشریه سال انتشار مقاله انگلیسی نسخه تمام متن
9812956 1518123 2005 14 صفحه PDF دانلود رایگان
عنوان انگلیسی مقاله ISI
The effect of deposition parameters and substrate surface condition on texture, morphology and stress in magnetron-sputter-deposited Cu thin films
موضوعات مرتبط
مهندسی و علوم پایه مهندسی مواد فناوری نانو (نانو تکنولوژی)
پیش نمایش صفحه اول مقاله
The effect of deposition parameters and substrate surface condition on texture, morphology and stress in magnetron-sputter-deposited Cu thin films
چکیده انگلیسی
Cu films, 5 and 500 nm thick, were sputtered onto amorphous SiO2 and Si3N4 substrates. The dependence of the film properties on the deposition pressure and the type and cleaning conditions of the substrate was investigated by Atomic Force Microscopy (AFM), Focused Ion Beam (FIB) Microscopy and X-ray diffraction (XRD). Cleaning the substrate leads to a smaller island size for the 5-nm-thick films, to the development of a columnar microstructure for the 500-nm-thick films and to a more pronounced {111} fiber texture for the Cu films on Si3N4 substrates. The tensile growth stress at the coalescence stage of the 5-nm-thick films reversed to compressive in the 500-nm-thick films owing to stress relief and to atomic peening. Sharper texture correlates with higher microstrain. Postdeposition annealing results in a more pronounced texture, grain growth and relaxation of the growth stress and the microstrain.
ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Thin Solid Films - Volume 474, Issues 1–2, 1 March 2005, Pages 50-63
نویسندگان
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