کد مقاله | کد نشریه | سال انتشار | مقاله انگلیسی | نسخه تمام متن |
---|---|---|---|---|
9812983 | 1518123 | 2005 | 10 صفحه PDF | دانلود رایگان |
عنوان انگلیسی مقاله ISI
Failure mechanisms of silver and aluminum on titanium nitride under high current stress
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موضوعات مرتبط
مهندسی و علوم پایه
مهندسی مواد
فناوری نانو (نانو تکنولوژی)
پیش نمایش صفحه اول مقاله
چکیده انگلیسی
The effects of high-current stress (3-10 A) on single-line structures of aluminum (Al) and silver (Ag) of different widths (2.5-10 μm) and on titanium nitride (TiN) as barrier are reported in this paper. As the applied current-densities were increased, the lines experienced catastrophic failure. In the cases of Al/TiN/SiO2 and Ag/TiN/Si, failure occurred at individual sites that were distributed over the length of the line. Failure times, for all line widths and for both metallizations, showed a non-linear dependence on current density. The current-density exponent (m) was calculated for the different structures. For Al/TiN/SiO2 and Ag/TiN/Si lines, the value of m was found to be â¼1.4-1.6 and â¼1.2-1.4, respectively, lower than the value of 2 reported in the literature for Al/SiO2 structures. The current-density exponents were found to be independent of line widths. Failed structures were characterized using analytical tools. The mode/mechanism of failure was found to be Joule-heating induced vaporization of the metallization followed by mechanical failure of the barrier TiN (for Al/TiN/SiO2), or melting and vaporization of the barrier TiN (for Ag/TiN/Si).
ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Thin Solid Films - Volume 474, Issues 1â2, 1 March 2005, Pages 235-244
Journal: Thin Solid Films - Volume 474, Issues 1â2, 1 March 2005, Pages 235-244
نویسندگان
E. Misra, C. Marenco, N.D. Theodore, T.L. Alford,