Keywords: مکانیزم مکانیکی شیمیایی; Chemical mechanical planarization; Metal oxide particle; Chemical additive; Interaction; Toxicity; Zebrafish embryo;
مقالات ISI مکانیزم مکانیکی شیمیایی (ترجمه نشده)
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Keywords: مکانیزم مکانیکی شیمیایی; Ruthenium; Sodium hypochlorite; Chemical mechanical planarization; Etching;
Keywords: مکانیزم مکانیکی شیمیایی; Paired polishing process; Total material removal; Material removal modeling; Surface roughness; Chemical Mechanical Planarization; Precision manufacturing
Keywords: مکانیزم مکانیکی شیمیایی; Chemical mechanical planarization; Abrasive particles shape; Molecular-scale removal; Modeling
Keywords: مکانیزم مکانیکی شیمیایی; Shallow trench isolation; Chemical Mechanical Planarization; High selectivity; Ceria; Lanthanum
Keywords: مکانیزم مکانیکی شیمیایی; High-k metal gate; Chemical mechanical planarization; Chemical kinetics; Contact mechanics; Surface profile; Dishing
Keywords: مکانیزم مکانیکی شیمیایی; Nanoparticle; Al2O3; CeO2; SiO2; Chemical mechanical planarization; Slurry; Alveolar macrophage; Inflammation; Redox activity
Keywords: مکانیزم مکانیکی شیمیایی; Silica; PEI; Chemical mechanical planarization; Copper; Dishing; Physico-chemical behavior
Keywords: مکانیزم مکانیکی شیمیایی; Core/shell structure; Composite abrasive; Synergistic effect; Chemical mechanical planarization;
Keywords: مکانیزم مکانیکی شیمیایی; Chemical mechanical planarization; Barrier layer; Weakly alkaline slurry; Dishing and erosion; Correction;
Keywords: مکانیزم مکانیکی شیمیایی; Diamond fracture; Aggressive diamond; Chemical mechanical planarization
Keywords: مکانیزم مکانیکی شیمیایی; Mean residence time; Slurry utilization efficiency; Chemical mechanical planarization
Integrated electrochemical analysis of polyvinyl pyrrolidone (PVP) as the inhibitor for copper chemical mechanical planarization (Cu-CMP)
Keywords: مکانیزم مکانیکی شیمیایی; Chemical mechanical planarization; Electrochemical impedance spectra; Electrochemical noise; Slurry; Inhibitors;
Fabrication, characterization, and CMP performance of dendritic mesoporous-silica composite particles with tunable pore sizes
Keywords: مکانیزم مکانیکی شیمیایی; Mesoporous silica; Core/shell structure; Composite particle; Pore size; Chemical mechanical planarization;
Chemical/mechanical balance management through pad microstructure in CMP
Keywords: مکانیزم مکانیکی شیمیایی; Chemical mechanical planarization; CMP; Pad roughness; Pores; Asperities; Wafer roughness; Removal rate; Defect level;
Adaptive virtual metrology for semiconductor chemical mechanical planarization process using GMDH-type polynomial neural networks
Keywords: مکانیزم مکانیکی شیمیایی; Chemical mechanical planarization; Virtual metrology; Semiconductor; GMDH; Neural networks;
Chemical mechanical planarization of germanium using oxone® based silica slurries
Keywords: مکانیزم مکانیکی شیمیایی; Chemical mechanical planarization; Germanium; Oxone; Fumed silica; Removal rate;
Fabrication of top-down gold nanostructures using a damascene process
Keywords: مکانیزم مکانیکی شیمیایی; Gold; Chemical mechanical planarization; Removal rate; Damascene; Micro-nano-structures;
Nanoscratching of copper surface by CeO2
Keywords: مکانیزم مکانیکی شیمیایی; Chemical mechanical planarization; CeO2 tip; Nanoscratch; Coefficient of friction; Wear;
Investigation of the barrier slurry with better defect performance and facilitating post-CMP cleaning
Keywords: مکانیزم مکانیکی شیمیایی; Chemical mechanical planarization; Barrier slurry; Particle size; Defect free; Scratch; Galvanic corrosion;
Influence of slurry components on copper CMP performance in alkaline slurry
Keywords: مکانیزم مکانیکی شیمیایی; Chemical mechanical planarization; Slurry components; Material removal rate; Within-wafer non-uniformity; Surface roughness;
CuO embedded silica nanoparticles for tungsten oxidation via a heterogeneous Fenton-like reaction
Keywords: مکانیزم مکانیکی شیمیایی; Silica; Fenton reaction; Hydroxyl radical; Tungsten oxidation; Chemical mechanical planarization;
Multi-objective optimization of tungsten CMP slurry for advanced semiconductor manufacturing using a response surface methodology
Keywords: مکانیزم مکانیکی شیمیایی; Chemical mechanical planarization; Optimization; Response surface methodology; Slurries; Semiconductor manufacturing process;
Improvement of via dishing and non-uniformity in TSV chemical mechanical planarization
Keywords: مکانیزم مکانیکی شیمیایی; Through-silicon via; Chemical mechanical planarization; Via dishing; Non-uniformity
The optimization of chemical mechanical planarization process-parameters of c-plane gallium-nitride using Taguchi method and grey relational analysis
Keywords: مکانیزم مکانیکی شیمیایی; Chemical mechanical planarization; c-plane GaN; Taguchi method; Grey relational analysis
Microbial biofilms for the removal of Cu2+ from CMP wastewater
Keywords: مکانیزم مکانیکی شیمیایی; Biofilm; Biosorption; Chemical mechanical planarization; Wastewater;
Effects of CMP slurry additives on the agglomeration of alumina nanoparticles 1: General aggregation rate behavior
Keywords: مکانیزم مکانیکی شیمیایی; Agglomeration; Aggregation; Nanoparticles; Chemical mechanical planarization; Zeta potential; Isoelectric point
Effects of chemical mechanical planarization slurry additives on the agglomeration of alumina nanoparticles II: Aggregation rate analysis
Keywords: مکانیزم مکانیکی شیمیایی; Agglomeration; Aggregation; Nanoparticles; Chemical mechanical planarization; Zeta potential; Isoelectric point; Aggregation rate; Reaction limited; Diffusion limited
Benzotriazole as a passivating agent during chemical mechanical planarization of Ni-P alloy substrates
Keywords: مکانیزم مکانیکی شیمیایی; Chemical mechanical planarization; Nickel-phosphorus alloy; Benzotriazole; Passivation;
Endpoint detection of Ge2Sb2Te5 during chemical mechanical planarization
Keywords: مکانیزم مکانیکی شیمیایی; Endpoint detection; Ge2Sb2Te5; Chemical mechanical planarization;
Effect of iron(III) nitrate concentration on tungsten chemical-mechanical-planarization performance
Keywords: مکانیزم مکانیکی شیمیایی; Tungsten; Chemical mechanical planarization; Oxidizer; Fe(NO3)3; Catalyst;
Effect of retaining ring slot designs and polishing conditions on slurry flow dynamics at bow wave
Keywords: مکانیزم مکانیکی شیمیایی; Chemical mechanical planarization; Retaining ring slot designs; Slurry flow dynamics; Bow wave;
Chemical mechanical planarization of germanium shallow trench isolation structures using silica-based dispersions
Keywords: مکانیزم مکانیکی شیمیایی; Germanium; Shallow trench isolation; Chemical mechanical planarization; Silica slurries
A feature scale Greenwood–Williamson model predicting pattern-size effects in CMP
Keywords: مکانیزم مکانیکی شیمیایی; Chemical mechanical planarization; CMP; Modeling; Greenwood–Williamson; Pad roughness; Asperity; Pitch; Size effects; Feature rounding; Feature scale model
Diamond disc pad conditioning in chemical mechanical planarization (CMP): A surface element method to predict pad surface shape
Keywords: مکانیزم مکانیکی شیمیایی; Abrasives; Chemical mechanical planarization; Conditioning; Dressing; Kinematic analysis; Mathematic model; Semiconductor materials
Investigation of pad staining and its effect on removal rate in copper chemical mechanical planarization
Keywords: مکانیزم مکانیکی شیمیایی; Chemical mechanical planarization; Pad staining; Copper removal rate; Pad surface topography; Hydrodynamic pressure B
Investigation of agglomerated Cu seed on Cu oxidation after chemical mechanical planarization
Keywords: مکانیزم مکانیکی شیمیایی; Chemical mechanical planarization; Cu-oxide defect; Cu seed layer; Agglomeration;
Studying the effect of temperature on the copper oxidation process using hydrogen peroxide for use in multi-step chemical mechanical planarization models
Keywords: مکانیزم مکانیکی شیمیایی; Chemical mechanical planarization; Copper oxidation; Modeling
A three-step copper chemical mechanical planarization model including the dissolution effects of a commercial slurry
Keywords: مکانیزم مکانیکی شیمیایی; Chemical mechanical planarization; Copper oxide dissolution; Modelling
Investigating the effect of diamond size and conditioning force on chemical mechanical planarization pad topography
Keywords: مکانیزم مکانیکی شیمیایی; Chemical mechanical planarization; Pad topography; Surface abruptness; Diamond disc
Effects of diamond size of CMP conditioner on wafer removal rates and defects for solid (non-porous) CMP pad with micro-holes
Keywords: مکانیزم مکانیکی شیمیایی; Chemical mechanical planarization; Solid pad; Porous pad; Micro-holes; Diamond conditioner
The effect of hydrogen peroxide on polishing removal rate in CMP with various abrasives
Keywords: مکانیزم مکانیکی شیمیایی; 81.65.Ps; 85.40.Ls; Chemical mechanical planarization; Shallow trench isolation; Selectivity; Abrasives; Additives;
Characterization of thermoset and thermoplastic polyurethane pads, and molded and non-optimized machined grooving methods for oxide chemical mechanical planarization applications
Keywords: مکانیزم مکانیکی شیمیایی; CMP; Friction; Chemical mechanical planarization; Planarization; Silicon oxide; Pad material; Groove
The brazing of diamond
Keywords: مکانیزم مکانیکی شیمیایی; Diamond brazing; Pad conditioner; Chemical mechanical planarization
Crystalline structure of ceria particles controlled by the oxygen partial pressure and STI CMP performances
Keywords: مکانیزم مکانیکی شیمیایی; 11.55.Fv; 61.82.Rx; 61.43.Gt; Chemical mechanical planarization; Ceria; Crystalline structure;
Role of abrasives in high selectivity STI CMP slurries
Keywords: مکانیزم مکانیکی شیمیایی; Chemical mechanical planarization; Shallow trench isolation; Glutamic acid; Ceria; Silica
Feasibility of real-time detection of abnormality in inter layer dielectric slurry during chemical mechanical planarization using frictional analysis
Keywords: مکانیزم مکانیکی شیمیایی; Slurry; Contamination; CMP; Friction; Chemical mechanical planarization; Planarization; Surface defects; Silicon oxide; Frictional forces; Spectral analysis
Nature and removal of the modified layer in Cu CMP with ferric nitrate as oxidizer
Keywords: مکانیزم مکانیکی شیمیایی; Chemical mechanical planarization; Oxidizer concentration; Ferric nitrate; Removal rate; Debris
Chemical mechanical planarization operation via dynamic programming
Keywords: مکانیزم مکانیکی شیمیایی; Chemical mechanical planarization; Dynamic programming; Non-planarization index; Copper dishing; Oxide erosion
Electrochemical impedance characteristics of Ta/Cu contact regions in polishing slurries used for chemical mechanical planarization of Ta and Cu: considerations of galvanic corrosion
Keywords: مکانیزم مکانیکی شیمیایی; Chemical mechanical planarization; Copper electrode; Galvanic corrosion; Impedance spectroscopy; Tantalum electrode