A case study on the impact of local material chemistry on the mechanical reliability of packaged integrated circuits: Correlation of the packaging fallout to the chemistry of passivation dielectrics

► Impact of encapsulating dielectric properties on post-packaging device failure rate. ► Encapsulating dielectric layer characteristics influence device failure rate. ► Device failure rate increases with the effective Young's modulus of encapsulating dielectric. ► Increase in SiOH concentration in dielectrics results in a decrease in SiOx Young's modulus. ► Device failure rate reduces with increase in SiOH concentration in the SiOx.