An investigation into the tribological performance of Physical Vapour Deposition (PVD) coatings on high thermal conductivity Cu-alloy substrates and the effect of an intermediate electroless Ni-P layer prior to PVD treatment

► PVD CrN and CrAlN coatings were deposited onto three types of copper alloys. ► An electroless Ni-P layer was also used between PVD coatings and Cu substrates. ► The use of an intermediate Ni-P layer improved PVD coating adhesion to Cu alloys. ► This layer also enhanced the tribological performance of PVD-coated Cu alloys. ► CrN films were more suited to one alloy type whilst CrAlN to the other two types.