کد مقاله | کد نشریه | سال انتشار | مقاله انگلیسی | نسخه تمام متن |
---|---|---|---|---|
10670196 | 1008853 | 2011 | 5 صفحه PDF | دانلود رایگان |
عنوان انگلیسی مقاله ISI
Effect of thermal cycling on the adhesion strength of Ti/Ni/Ag films on AlN substrate
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کلمات کلیدی
موضوعات مرتبط
مهندسی و علوم پایه
مهندسی مواد
فناوری نانو (نانو تکنولوژی)
پیش نمایش صفحه اول مقاله
![عکس صفحه اول مقاله: Effect of thermal cycling on the adhesion strength of Ti/Ni/Ag films on AlN substrate Effect of thermal cycling on the adhesion strength of Ti/Ni/Ag films on AlN substrate](/preview/png/10670196.png)
چکیده انگلیسی
The adhesion strength of Ti/Ni/Ag multi-layers on AlN substrates before and after thermal cycling treatment was studied. The Ti/Ni/Ag layers with thicknesses of 0.6, 1.0, and 0.2 μm, respectively, were deposited sequentially on bulk AlN substrates using direct current (DC) sputtering. Thermal cycling test (TCT) was conducted for 0, 15, 100, and 300 cycles to measure the adhesion strength of Ti/Ni/Ag on AlN. The adhesion strength of the deposited specimen increased slightly over 15 thermal cycles and increased abruptly after 100 thermal cycles. After 100 thermal cycles, Ti reacted with AlN substrate to form TiN and TiO. The formation of TiN and TiO at the Ti/AlN interface may be responsible for the increase of the adhesion strength after a large number of thermal cycles.
ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Thin Solid Films - Volume 519, Issue 16, 1 June 2011, Pages 5539-5543
Journal: Thin Solid Films - Volume 519, Issue 16, 1 June 2011, Pages 5539-5543
نویسندگان
Wei-Luen Jang, Tsung-Chieh Chiu, Kwang-Lung Lin,