Self-alignment method for solution-processable dielectric structures via joule heating

We present a versatile method to create self-aligned patterns of polymer dielectric on metal by the use of Joule heating. In contrast to global thermal or light based curing, the method self-aligns the dielectric to a metal pattern on the substrate. A current-induced temperature rise along a metal line cures the insulator locally; uncured material is then removed by rinsing with solvent. We have obtained very promising results for aligning thermally cross-linkable and selectively baked dielectrics. Alignment of cross-linkable polymers is less sensitive to the rinsing step than selectively baked dielectrics. Finite-element simulations were used to determine the range of suitable curing current. After optimization of the curing parameters high yield and low leakage dielectrics were obtained.