Characterization of silicon oxide gas barrier films with controlling to the ion current density (ion flux) by plasma enhanced chemical vapor deposition

Silicon oxide gas barrier films were deposited on polyethylene terephthalate (PET) substrates by plasma enhanced chemical vapor deposition (PE-CVD) for applications to transparent barrier packaging. The barrier properties of the silicon oxide coated film were optimized by varying the bias conditions and input power in the radio frequency plasma. The plasma diagnostics, ion current density and substrate temperature were characterized by optical emission spectrometry (OES), an oscilloscope and thermometer, respectively. The coating properties were examined by Fourier transform infrared (FT-IR) spectroscopy and the water vapor transmission rate (WVTR). A high intensity of O and H ions and a high ion current density (ion flux) with a low temperature plasma process were found to be suitable for improving the barrier properties of the silicon oxide film coatings. The Si–O cage-like structure adversely affected the gas barrier properties of the deposited coating. The energy provided by ion bombardment (ion flux) can induce changes in the film density and composition similar to those that may occur by the increase in deposition temperature through rf bias. In addition, the film properties depend not only on a high ion current density (ion flux) and input power, but are also related to a silicon oxide film with a widely distributed planar ring size.