کد مقاله | کد نشریه | سال انتشار | مقاله انگلیسی | نسخه تمام متن |
---|---|---|---|---|
1669679 | 1008887 | 2010 | 6 صفحه PDF | دانلود رایگان |
An optimized process was developed for fabrication of high-aspect-ratio photoresist-derived carbon microelectrode array on silicon substrate. This process consisted of conventional photolithography, three-step linear pyrolyzing process and micromechanical interlocking. Comparing with previous two-step pyrolysis, three-step linear pyrolysis process can better preserve the geometry of microstructure during pyrolysis, and micromechanical interlocking was introduced to improve bonding strength between carbon microstructure and substrate. As a result, it can be achieved that high-aspect-ratio carbon microelectrode array remained upright and robustly with substrate. The experimental results confirmed that the optimized process is very effective, and the technology will be helpful for integration of 3-dimensional carbon-based devices in the fields of bioMEMS and electrochemical analysis.
Journal: Thin Solid Films - Volume 518, Issue 10, 1 March 2010, Pages 2701–2706