Multi-gate devices for the 32 nm technology node and beyond: Challenges for Selective Epitaxial Growth

This work will focus on the use of Selective Epitaxial Growth (SEG) of Si and SiGe in multi-gate devices. We will demonstrate the necessity of using SEG in the processing of these narrow fin devices. Reductions of the source/drain resistance and Gate Induced Drain Leakage (GIDL) are the main advantages of using SEG. Although the use of SiGe SEG has little impact as mobility booster in narrow fin pMOS devices, it provides a significant reduction in contact resistance.