Plasma-chemical surface functionalization of flexible substrates at atmospheric pressure

We demonstrated here fascicle surface functionalization of poly(tetrafluoroethylene) [PTFE] sheet through an atmospheric pressure plasma liquid deposition [APPLD] technique to design the interface for improvement of copper plated layer adhesion. We found that radiation with atmospheric pressure plasma to the PTFE sheet covered with thin liquid film, containing both an ion trapping polymer and copper ion (Cu2+), simultaneously brought about the direct polymer grafting onto the PTFE surface and Cu2+ ion reduction to metallic Cu. The treated surface was characterized by water contact angle measurement, X-ray photoelectron spectroscopy, and atomic force microscopy.