کد مقاله کد نشریه سال انتشار مقاله انگلیسی نسخه تمام متن
1671929 1008926 2009 6 صفحه PDF دانلود رایگان
عنوان انگلیسی مقاله ISI
Structural, electrical, and optical properties of copper indium diselenide thin film prepared by thermal evaporation method
موضوعات مرتبط
مهندسی و علوم پایه مهندسی مواد فناوری نانو (نانو تکنولوژی)
پیش نمایش صفحه اول مقاله
Structural, electrical, and optical properties of copper indium diselenide thin film prepared by thermal evaporation method
چکیده انگلیسی

Stoichiometric compound of copper indium diselenide (CuInSe2) was synthesized by direct reaction of high-purity elemental copper, indium and selenium in an evacuated quartz ampoule. The phase structure and composition of the synthesized pulverized material analyzed by X-ray diffraction (XRD) and energy dispersive analysis of X-rays (EDAX) revealed the chalcopyrite structure and stoichiometry of elements. Thin films of CuInSe2 were deposited onto organically cleaned soda lime glass substrates held at different temperatures (i.e. 300 K to 573 K) using thermal evaporation technique. CuInSe2 thin films were then thermally annealed in a vacuum chamber at 573 K at a base pressure of 10− 2 mbar for 1 h. The effect of substrate temperature (Ts) and thermal annealing (Ta) on structural, compositional, morphological, optical and electrical properties of films were investigated using XRD, transmission electron microscopy, EDAX, atomic force microscopy (AFM), optical transmission measurements and Hall effect techniques. XRD and EDAX studies of CuInSe2 thin films revealed that the films deposited in the substrate temperature range of 423–573 K have preferred orientation of grains along the (112) plane and near stoichiometric composition. AFM analysis indicates that the grain size increases with increase of Ts and Ta. Optical and electrical characterizations of films suggest that CuInSe2 thin films have high absorption coefficient (104 cm− 1) and resistivity value in the interval 10− 2–101 Ω cm influenced by Ts and Ta.

ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Thin Solid Films - Volume 517, Issue 13, 1 May 2009, Pages 3639–3644
نویسندگان
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