کد مقاله کد نشریه سال انتشار مقاله انگلیسی نسخه تمام متن
1673192 1008945 2009 5 صفحه PDF دانلود رایگان
عنوان انگلیسی مقاله ISI
Effect of residual stresses on mechanical properties and interface adhesion strength of SiN thin films
موضوعات مرتبط
مهندسی و علوم پایه مهندسی مواد فناوری نانو (نانو تکنولوژی)
پیش نمایش صفحه اول مقاله
Effect of residual stresses on mechanical properties and interface adhesion strength of SiN thin films
چکیده انگلیسی

Residual stresses play a significant role in the mechanical reliability of thin films. Thus in this study, the mechanical properties and interface adhesion strengths of SiN thin films containing different residual stresses have been investigated by using nanoindentation and nanoscratch tests. With varied residual stresses from compressive to tensile, the penetration depth of nanoindentation tests shifted to a higher value. The hardness and elastic modulus decreased from 11.0 and 95 GPa, respectively, for the film containing a compressive stress of 235 MPa to 9.6 and 84 GPa for the film with a tensile stress of 86 MPa. With decreasing compressive stress and increasing tensile stress, the interface adhesion energy decreased from 1.8 to 1.5 J/m2. Compressive stresses were expected to blunt crack tips and inhibit crack propagation, while tensile stresses enlarged crack opening and facilitated crack propagation, thus changing the mechanical properties of the SiN thin films.

ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Thin Solid Films - Volume 517, Issue 17, 1 July 2009, Pages 4857–4861
نویسندگان
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