کد مقاله | کد نشریه | سال انتشار | مقاله انگلیسی | نسخه تمام متن |
---|---|---|---|---|
1673196 | 1008945 | 2009 | 4 صفحه PDF | دانلود رایگان |
عنوان انگلیسی مقاله ISI
Adhesion investigation of low-k films system using 4-point bending test
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کلمات کلیدی
موضوعات مرتبط
مهندسی و علوم پایه
مهندسی مواد
فناوری نانو (نانو تکنولوژی)
پیش نمایش صفحه اول مقاله

چکیده انگلیسی
This research presents a simulation-based methodology to accurately predict interfacial adhesion behaviors of heterostructures. Validation of the proposed approach is achieved through comparison of 4-point bending test results on interfaces of multiple stacked low-k films with those of theoretical solutions from the finite element analysis. Impact induced by the compliance of 4-point bending test system can be neglected using the averaged energy release rate of various crack lengths in simulations. On the basis of precise predictions drawn from the considered analyses, uncertainty of experimental tests for the nano-scale fractured strength could be promptly observed and estimated.
ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Thin Solid Films - Volume 517, Issue 17, 1 July 2009, Pages 4875–4878
Journal: Thin Solid Films - Volume 517, Issue 17, 1 July 2009, Pages 4875–4878
نویسندگان
Chang-Chun Lee, Jacky Huang, Shu-Tong Chang, Wei-Ching Wang,