High thermal stability of AlCrTaTiZr nitride film as diffusion barrier for copper metallization

To inhibit rapid Cu diffusion in interconnect structures, an effective diffusion barrier layer with high thermal stability, low electrical resistivity and good interface adhesion is strongly demanded. Thus in this study, an amorphous nitride film of equimolar AlCrTaTiZr alloy with an N content of about 41 at.% was deposited by reactive radio-frequency magnetron sputtering. Thermal stability of the AlCrTaTiZr nitride film and its barrier property to Cu diffusion were investigated under thermal annealing at 700–900 °C. The AlCrTaTiZr nitride film remained an amorphous structure after thermal annealing at 700 °C and then crystallized at 800 °C. However, no interdiffusion between Si substrate and Cu metallization through the AlCrTaTiZr nitride film occurred. The electrical resistivity of the film remained at the low level of as-deposited value, indicating its good thermal stability as an effective diffusion barrier layer. With temperature further increasing to 900 °C, severe interdiffusion occurred, along with the formation of silicides and large pores. The electrical resistivity then significantly increased, implying the failure of the AlCrTaTiZr nitride film.