کد مقاله | کد نشریه | سال انتشار | مقاله انگلیسی | نسخه تمام متن |
---|---|---|---|---|
1673606 | 1518085 | 2007 | 5 صفحه PDF | دانلود رایگان |

Understanding the mechanical behavior of nano-structured thin films in relation to their microstructure, in particular to the grain size, is of utmost importance for the development of technological applications. Model nanometric W/Cu multilayers exhibiting different microstructures and supported by a (thin) polyimide substrate are elaborated. The films mechanical response is characterized experimentally by tensile tests carried out in-situ in an X-ray diffractometer installed at a synchrotron beam line. The orientation dependence of elastic strains and stresses is determined by an appropriate micromechanical model accounting for the material microstructure, and based on homogenization schemes. While a good agreement is globally found, the model better reproduces the experimental results of the W component than those of Cu, due probably to the elastic anisotropy of Cu grains.
Journal: Thin Solid Films - Volume 516, Issues 2–4, 3 December 2007, Pages 320–324