Maintaining Cu metal integrity on low-k IMDs with a nanometer thick a-SiC:H film obtained by HWCVD

Hydrogenated amorphous silicon carbon (a-SiC:H) ultra thin films obtained by Hot wire chemical vapor deposition (HWCVD) have been shown to act as efficient diffusion barriers for copper on inter metal dielectric (IMD) layers which are of great significance for ultra-large scale integration (ULSI) circuits. In this work, we have studied the influence of the a-SiC:H barrier layer obtained by HWCVD which has implications towards issues related to the resistance to electromigration of Cu in the low dielectric (low-k) hydrogen silsesquioxane (HSQ) film. The presence of the ultra thin a-SiC:H film maintains the integrity of the Cu metal not only by suppressing Cu diffusion but also by increasing its crystallinity, which would have implications with respect to the mean time to failure (MTF) arising from metal electromigration. Though, we demonstrate this aspect on the low-k (HSQ)/Cu system, this should yield similar benefits for other low-k dielectric materials too.