Ti–Ni–Cu shape-memory alloy thin film formed on polyimide substrate

Ti–Ni–Cu shape-memory alloy (SMA) thin films were sputter-deposited on heated polyimide substrates. Ti–Ni–Cu films deposited at substrate temperatures of 543 and 583 K were found to be crystalline. Especially, a Ti48Ni29Cu23 film deposited at 583 K exhibited a high martensitic transformation temperature above room temperature and a narrow transformation temperature range, which enable the film to be used at room temperature. Double-beam cantilevers made of 8 μm thick Ti48Ni29Cu23 films deposited on 12.5 and 25 μm thick polyimide substrates displayed a repeatable shape-memory effect by a battery of 1.5 V and it was verified that the composite film consisting of an 8 μm thick Ti48Ni29Cu23 film and a 25 μm thick polyimide film is capable of moving 0.18 g wings of a dragonfly toy up and down. These results offer the prospect for using an SMA/polyimide actuator as a convenient small actuator, which will find wide-ranging applications.