Simple bond energy approach for non-destructive measurements of the fracture toughness of brittle materials

A simple bond breakage model for computing the fracture surface energy and toughness of a wide variety of brittle materials is presented and correlated against values reported in the literature for the single crystalline forms of these same materials. The correlation shows that this simple model can provide an accurate estimate for both the fracture surface energy and toughness of these materials. It is further shown that this simple model can be extended to amorphous materials with reasonable accuracy by normalizing the fracture surface energy of the crystalline material by the ratio of the density of the amorphous material vs. the density of the single crystalline material. Applications to thin film low-k materials and capabilities for non-destructive measurements are also discussed.