کد مقاله کد نشریه سال انتشار مقاله انگلیسی نسخه تمام متن
8032504 1517951 2018 29 صفحه PDF دانلود رایگان
عنوان انگلیسی مقاله ISI
Stability of the platinum electrode during high temperature annealing
ترجمه فارسی عنوان
پایداری الکترودهای پلاتین در دمای بالا
موضوعات مرتبط
مهندسی و علوم پایه مهندسی مواد فناوری نانو (نانو تکنولوژی)
چکیده انگلیسی
As a result of recrystallization Pt films became unsmooth at low annealing temperatures and as the temperature increased hillocks were formed on the film surface. Relaxation of the compressive stress in the Pt film, facilitating the reduction of its free energy and modification of the lattice parameter towards the equilibrium value, is known to be the major hillock formation mechanism. The level of intrinsic stress in the film and the annealing temperature both determine the initial hillock formation. The final hillock height, density, and size are related to the Pt layer thickness, sublayer structure, and to the annealing time and temperature. Optimization of the sublayer structure and annealing modes makes it possible to increase the annealing temperature to ca. 780°С without causing any substantial damages to Pt microrelief. That enables us to use these structures as the bottom electrode in ferroelectric memory cells.
ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Thin Solid Films - Volume 661, 1 September 2018, Pages 53-59
نویسندگان
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