Chemical mechanical polishing of transparent conductive layers using spherical cationic polymer microbeads

Spherical cationic polymer microbeads were used to chemically mechanically polish transparent conductive oxide (TCO) layers without the need for inorganic abrasives. Poly(methyl acrylate) (PMA) was used as the polymer matrix. Surface cationization of the spherical PMA microbeads was achieved by aminolysis using 1,2-diaminoethane. The amino group content of the microbeads was controlled using the aminolysis reaction time. The surface roughness of the TCO polished using the cationic polymer microbeads was similar to that of TCO polished with an inorganic abrasive. The microbead-polished TCO layer was slightly thinner than the unpolished TCO layer. The sheet resistance of the TCO layer polished using the microbeads was lower than that polished using the inorganic abrasive. The TCO polishing ability of the microbeads was dependent on their cationic properties and softness.