High rate low pressure plasma-enhanced chemical vapor deposition for barrier and optical coatings

► Plasma enhanced chemical vapor deposition (PECVD) at pressure less than 5 Pa ► Magnetron based magPECVD process with dynamic coating rates up to 400 nm m/min ► Hollow cathode arc based arcPECVD process shows up to 2700 nm m/min. ► Both processes can be used inline to sputtering for optical or barrier stacks. ► The so prepared coating stacks showed nearly no layer stress.