کد مقاله | کد نشریه | سال انتشار | مقاله انگلیسی | نسخه تمام متن |
---|---|---|---|---|
9813085 | 1518125 | 2005 | 7 صفحه PDF | دانلود رایگان |
عنوان انگلیسی مقاله ISI
A modified blister test to study the adhesion of thin coatings based on local helium ion implantation
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کلمات کلیدی
موضوعات مرتبط
مهندسی و علوم پایه
مهندسی مواد
فناوری نانو (نانو تکنولوژی)
پیش نمایش صفحه اول مقاله
چکیده انگلیسی
In this work, we present the first results of this blister test applied to W-C:H films and multilayers of Ti and Al deposited by Physical Vapour Deposition on polycrystalline copper substrates. The copper substrates were implanted with 34 keV He+ ions up to fluences of 3 and 5Ã1016 cmâ2 before the deposition of the coatings and annealed afterwards in vacuum at temperatures from 773 to 1073 K for 30 min. Delamination of the Ti/Al multilayer coatings was already detected after annealing at 873 K with an energy release rate estimated to be 0.5 J mâ2 at a typical helium pressure of 107 Pa. No delamination but only helium swelling was observed for W-C:H coatings annealed at 1073 K. Results of experiments on uncoated copper samples are also shown in order to explain the mechanism of helium bubble growth and helium release that causes the creation of the blisters.
ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Thin Solid Films - Volume 471, Issues 1â2, 3 January 2005, Pages 170-176
Journal: Thin Solid Films - Volume 471, Issues 1â2, 3 January 2005, Pages 170-176
نویسندگان
R. Escobar Galindo, A. van Veen, J.H. Evans, H. Schut, J.Th.M. de Hosson,