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Daneshyari Hardware and Architecture Journas Latest Articles

Hardware and Architecture Research Articles

Multiscale simulation of aluminum thin films for the design of highly-reliable MEMS devices
Fulltext Access 5 Pages 2009
Analysis of deep submicron VLSI technological risks: A new qualification process for professional electronics
Fulltext Access 5 Pages 2009
An investigation into the reliability of power modules considering baseplate solders thermal fatigue in aeronautical applications
Fulltext Access 5 Pages 2009
Estimation of SiC JFET temperature during short-circuit operations
Fulltext Access 5 Pages 2009
Source electrode evolution of a low voltage power MOSFET under avalanche cycling
Fulltext Access 5 Pages 2009
Capacitive RF MEMS analytical predictive reliability and lifetime characterization
Fulltext Access 5 Pages 2009
Comparing drop impact test method using strain gauge measurements
Fulltext Access 5 Pages 2009
Reading distance degradation mechanisms of near-field RFID devices
Fulltext Access 5 Pages 2009
A novel accelerated test technique for assessment of mechanical reliability of solder interconnects
Fulltext Access 5 Pages 2009
1300 V, 2 ms pulse inductive load switching test circuit with 20 ns selectable crowbar intervention
Fulltext Access 5 Pages 2009
Guide for Authors
Fulltext Access 5 Pages 2009
Life-time estimation of high-power blue light-emitting diode chips
Fulltext Access 5 Pages 2009
Analysis of humidity effects on the degradation of high-power white LEDs
Fulltext Access 5 Pages 2009
Characterization of stress degradation effects and thermal properties of AlGaN/GaN HEMTs with photon emission spectral signatures
Fulltext Access 5 Pages 2009
Failure analysis of video processor defined as No Fault Found (NFF): Reproduction in system level and advanced analysis technique in IC level
Fulltext Access 5 Pages 2009
An advanced quality and reliability assessment approach applied to thermal stress issues in electronic components and assemblies
Fulltext Access 5 Pages 2009
Electrical modeling of the effect of beam profile for pulsed laser fault injection
Fulltext Access 5 Pages 2009
IR thermography and FEM simulation analysis of on-chip temperature during thermal-cycling power-metal reliability testing using in situ heated structures
Fulltext Access 5 Pages 2009
The suppression of tin whisker growth by the coating of tin oxide nano particles and surface treatment
Fulltext Access 5 Pages 2009
Characterisation method for chip card ESD events causing terminal failures
Fulltext Access 5 Pages 2009
The influence of electron-beam irradiation on electrical characteristics of metal–insulator–semiconductor capacitors based on a high-k dielectric stack of HfTiSiO(N) and HfTiO(N) layers
Fulltext Access 5 Pages 2009
Design of a novel fault-tolerant voter circuit for TMR implementation to improve reliability in digital circuits
Fulltext Access 5 Pages 2009
Corrosion-induced degradation of GaAs PHEMTs under operation in high humidity conditions
Fulltext Access 5 Pages 2009
Stability of the J–V characteristics of (BEHP-PPV)-co-(MEH-PPV) based light-emitting diodes
Fulltext Access 5 Pages 2009
An ESD test reduction method for complex devices
Fulltext Access 5 Pages 2009
Trend transformation of drain-current degradation under drain-avalanche hot-carrier stress for CLC n-TFTs
Fulltext Access 5 Pages 2009
Modeling and characterization of molding compound properties during cure
Fulltext Access 5 Pages 2009
A new methodology for the identification of ball bond degradation during high-temperature aging tests on devices in standard plastic packages
Fulltext Access 5 Pages 2009
Towards elastic anisotropy and strain-induced void formation in Cu–Sn crystalline phases
Fulltext Access 5 Pages 2009
Kirkendall voids formation in the reaction between Ni-doped SnAg lead-free solders and different Cu substrates
Fulltext Access 5 Pages 2009
Extended metallization reliability testing: Combining standard wafer level with product tests to increase test sensitivity
Fulltext Access 5 Pages 2009
Two-stage hot-carrier degradation behavior of 0.18 μm 18 V n-type DEMOS and its recovery effect
Fulltext Access 5 Pages 2009
Study on the performance of sub 100 nm LACLATI MOSFETs for digital application
Fulltext Access 5 Pages 2009
Subthreshold parameters of radio-frequency multi-finger nanometer MOS transistors
Fulltext Access 5 Pages 2009
Structure optimization of multi-finger power SiGe HBTs for thermal stability improvement
Fulltext Access 5 Pages 2009
Analytical analysis of nanoscale multiple gate MOSFETs including effects of hot-carrier induced interface charges
Fulltext Access 5 Pages 2009
Comparison and evaluation of newest failure rate prediction models: FIDES and RIAC 217Plus
Fulltext Access 5 Pages 2009
Effects of low gate bias annealing in NBT stressed p-channel power VDMOSFETs
Fulltext Access 5 Pages 2009
Compute and storage clouds using wide area high performance networks
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Study for pulse stress NBTI characteristics degradation stress
Fulltext Access 5 Pages 2009
A recursive architecture for hierarchical grid resource management
Fulltext Access 5 Pages 2009
End of Volume Reviewer Index
Fulltext Access 5 Pages 2009
CMOS logic gate performance variability related to transistor network arrangements
Fulltext Access 5 Pages 2009
Ensuring the reliability of electron beam crosslinked electric cables by the optimization of the dose depth distribution with Monte Carlo simulation
Fulltext Access 5 Pages 2009
An algorithm for clock synchronization with the gradient property in sensor networks
Fulltext Access 5 Pages 2009
Impact of O–Si–O bond angle fluctuations on the Si–O bond-breakage rate
Fulltext Access 5 Pages 2009
Fast reliability qualification of SiP products
Fulltext Access 5 Pages 2009
Lessons not learned on data disposal
Fulltext Access 5 Pages 2009
Teleporter: An analytically and forensically sound duplicate transfer system
Fulltext Access 5 Pages 2009
Jitter analysis of PLL-generated clock propagation using Jitter Mitigation techniques with laser voltage probing
Fulltext Access 5 Pages 2009
Mapping of nomadic multimedia applications on the ADRES reconfigurable array processor
Fulltext Access 5 Pages 2009
ESD testing of devices, ICs and systems
Fulltext Access 5 Pages 2009
Removal of post-etch photoresist and sidewall residues using organic solvent and additive combined with physical forces
Fulltext Access 5 Pages 2009
Effects of plasmas on porous low dielectric constant CVD SiOCH films
Fulltext Access 5 Pages 2009
Special section: OptIPlanet - The OptIPuter global collaboratory
Fulltext Access 5 Pages 2009
Grid-based deployment and performance measurement of the Weather Research & Forecasting model
Fulltext Access 5 Pages 2009
Breakdown characterization of gate oxides in 35 and 70 Å BCD8 smart power technology
Fulltext Access 5 Pages 2009
Percolation theory applied to PZT thin films capacitors breakdown mechanisms
Fulltext Access 5 Pages 2009
Experimental study about gate oxide damages in patterned MOS capacitor irradiated with heavy ions
Fulltext Access 5 Pages 2009
Dynamic photonic lightpaths in the StarPlane network
Fulltext Access 5 Pages 2009
OptIPuter: Enabling advanced applications with novel optical control planes and backplanes
Fulltext Access 5 Pages 2009
A path finding implementation for multi-layer networks
Fulltext Access 5 Pages 2009
Reversible dielectric breakdown in ultrathin Hf based high-k stacks under current-limited stresses
Fulltext Access 5 Pages 2009
On the temperature and voltage dependence of short-term negative bias temperature stress
Fulltext Access 5 Pages 2009
Influence of various process steps on the reliability of PMOSFETs submitted to negative bias temperature instabilities
Fulltext Access 5 Pages 2009
Investigating the CDM susceptibility of IC’s at package and wafer level by capacitive coupled TLP
Fulltext Access 6 Pages 2009
A new two-dimensional subthreshold behavior model for the short-channel asymmetrical dual-material double-gate (ADMDG) MOSFET’s
Fulltext Access 6 Pages 2009
CDM tests on interface test chips for the verification of ESD protection concepts
Fulltext Access 6 Pages 2009
Intrinsic stress fracture energy measurements for PECVD thin films in the SiOxCyNz:H system
Fulltext Access 6 Pages 2009
Prototyping of a reliable 3D flexible IC cube package by laser micromachining
Fulltext Access 6 Pages 2009
Board level investigation of BGA solder joint deformation strength
Fulltext Access 6 Pages 2009
Effect of Ag, Fe, Au and Ni on the growth kinetics of Sn–Cu intermetallic compound layers
Fulltext Access 6 Pages 2009
An investigation of Sn pest in pure Sn and Sn-based solders
Fulltext Access 6 Pages 2009
Physical phenomena affecting performance and reliability of 4H–SiC bipolar junction transistors
Fulltext Access 6 Pages 2009
Study of stress-induced leakage current (SILC) in HfO2/Dy2O3 high-κ gate stacks on germanium
Fulltext Access 6 Pages 2009
A new photoimageable platinum conductor
Fulltext Access 6 Pages 2009
Physical degradation of GaN HEMT devices under high drain bias reliability testing
Fulltext Access 6 Pages 2009
Heat management for power converters in sealed enclosures: A numerical study
Fulltext Access 6 Pages 2009
Investigation on marginal failure characteristics and related defects analysed by soft defect localization
Fulltext Access 6 Pages 2009
Investigation of stress distribution in via bottom of Cu-via structures with different via form by means of submodeling
Fulltext Access 6 Pages 2009
Magnetic microscopy for 3D devices: Defect localization with high resolution and long working distance on complex system in package
Fulltext Access 6 Pages 2009
A study of electrical characteristic changes in MOSFET by electron beam irradiation
Fulltext Access 6 Pages 2009
Statistical RTS model for digital circuits
Fulltext Access 6 Pages 2009
Characterisation and modelling of parasitic effects and failure mechanisms in AlGaN/GaN HEMTs
Fulltext Access 6 Pages 2009
Behavior of hot carrier generation in power SOI LDNMOS with shallow trench isolation (STI)
Fulltext Access 6 Pages 2009
Fabrication process simulation and reliability improvement of high-brightness LEDs
Fulltext Access 6 Pages 2009
Design for reliability of power electronics modules
Fulltext Access 6 Pages 2009
Microstructure evolution observation for SAC solder joint: Comparison between thermal cycling and thermal storage
Fulltext Access 6 Pages 2009
Investigation of defects introduced by static and dynamic hot carrier stress on SOI partially depleted body-contact MOSFETs
Fulltext Access 6 Pages 2009
Electrical aging behavioral modeling for reliability analyses of ionizing dose effects on an n-MOS simple current mirror
Fulltext Access 6 Pages 2009
Dielectric charging in silicon nitride films for MEMS capacitive switches: Effect of film thickness and deposition conditions
Fulltext Access 6 Pages 2009
Thermal imaging of smart power DMOS transistors in the thermally unstable regime using a compact transient interferometric mapping system
Fulltext Access 6 Pages 2009
Reliability considerations in pulsed power resonant conversion
Fulltext Access 6 Pages 2009
Accelerated active ageing test on SiC JFETs power module with silver joining technology for high temperature application
Fulltext Access 6 Pages 2009
Uni-axial mechanical stress effect on Trench Punch through IGBT under short-circuit operation
Fulltext Access 6 Pages 2009
Three-dimensional finite-element thermal simulation of GaN-based HEMTs
Fulltext Access 6 Pages 2009
Effects of soft segment mixtures with different molecular weight on the properties and reliability of UV curable adhesives for electrodes protection of plasma display panel (PDP)
Fulltext Access 6 Pages 2009
Study of gate dielectric permittivity variation with different equivalent oxide thickness on channel engineered deep sub-micrometer n-MOSFET device for mixed signal applications
Fulltext Access 6 Pages 2009
Employing vertical dielectric layers to improve the operation performance of flash memory devices
Fulltext Access 6 Pages 2009
Correlation between EOS customer return failure cases and Over Voltage Stress (OVS) test method
Fulltext Access 6 Pages 2009
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