Characterization of Al/Ni multilayers and their application in diffusion bonding of TiAl to TiC cermet

► Diffusion bonding of TiAl to TiC cermet was realized using Al/Ni multilayer. ► The reaction sequence of the Al/Ni multilayers was Al3Ni → Al3Ni2 → AlNi → AlNi3. ► The interfacial microstructure of the joint was clarified. ► The application of Al/Ni multilayers improved the joining quality.