کد مقاله کد نشریه سال انتشار مقاله انگلیسی نسخه تمام متن
1665387 1518038 2014 6 صفحه PDF دانلود رایگان
عنوان انگلیسی مقاله ISI
Platinum thin films with good thermal and chemical stability fabricated by inductively coupled plasma-enhanced atomic layer deposition at low temperatures
ترجمه فارسی عنوان
فیلم های نازک پلاتین با پایداری حرارتی و شیمیایی خوب ساخته شده توسط رسوب گذار لایه اتمی با افزایش القایی با دمای پلاسما در دماهای پایین ساخته شده است
کلمات کلیدی
پلاسما همراه با انسولین رسوب لایه اتمی، ریسندگی دیسک رآکتور، پلاتین
موضوعات مرتبط
مهندسی و علوم پایه مهندسی مواد فناوری نانو (نانو تکنولوژی)
چکیده انگلیسی


• Inductively coupled plasma applied to enhance atomic layer deposition (PEALD)
• Smooth Pt films fabricated by PEALD at low temperature
• 8-nm Pt shows clear metal peaks in XPS and XRD.
• 8-nm Pt shows low electrical resistivity of 16 μΩ cm.
• 8-nm Pt shows stability under strong light and pH = 12 wash by NH4+/NaOH solution.

The inductively coupled plasma-enhanced atomic layer deposition (PEALD) method was used to fabricate ultrathin and smooth Pt thin films at low temperatures without the use of a Pt seed layer. The Pt thin metal films deposited at 200 °C onto Si and glass substrates exhibited high conductivities (< 12 μΩ cm for films with a thickness greater than 8 nm) and thermal stabilities resembling those of the bulk material. The measured density of the deposited Pt thin films was 20.7 ± 6 g/cm3. X-ray photoelectron spectra of the films showed clear 4f peaks (74.3 eV (4f5/2) and 71.1 eV (4f7/2)), and X-ray diffraction measurements showed the (111) peak of the fcc structure. The deposited Pt layers were in crystal form. The 25.5-nm Pt films coated onto 170-nm-wide trench structures (aspect ratio of 3.5:1) exhibited good step coverage. The PEALD-deposited Pt thin films were chemically stable under high-temperature light illumination and could serve as catalysts under strongly alkaline conditions (pH = 12) during the long-term oxidization of ammonium ions.

ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Thin Solid Films - Volume 566, 1 September 2014, Pages 93–98
نویسندگان
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