Extracting thin film hardness of extremely compliant films on stiff substrates

A previously reported method for extracting the thin film hardness from nanoindentation into a film on an elastically mismatched substrate was applied to four different cases of extreme mismatch in elastic properties: Parmax, Ultem, Polysulfone and Perfluorocyclobutyl polymer thin films on Si substrates. All of these cases represent extremely compliant films on a stiff substrate, where the ratio of film shear modulus to substrate shear modulus ranged from 0.008 to 0.036. Analyzing the nanoindentation data into these film/substrate systems poses a significant limitation when using the Oliver and Pharr method as the hardness increases rapidly with indentation depth. Therefore, a method involving the measured contact stiffnesses to more accurately determine the correct contact areas was used to extract the true hardness of the polymer thin films. The results indicate that our method is able to remove the substrate effects as well as the complications arising from pile-up and surface roughness to yield a wide plateau in hardness despite the extreme elastic mismatch conditions.