کد مقاله | کد نشریه | سال انتشار | مقاله انگلیسی | نسخه تمام متن |
---|---|---|---|---|
1670029 | 1008894 | 2010 | 4 صفحه PDF | دانلود رایگان |

The residual stress and its evolution with time in poly(vinylidene-fluoride-co-trifluoroethylene) (P(VDF-TrFE) (72/28)) piezoelectric polymer thin films deposited on silicon wafers were investigated using the wafer curvature method. Double-side polished silicon wafers with minimized initial wafer warpage were used to replace single-side polished silicon wafers to obtain significantly improved reliability for the measurement of the low residual stress in the P(VDF-TrFE) polymer thin films. Our measurement results showed that all the P(VDF-TrFE) films possessed a tensile residual stress, and the residual stress slowly decreased with time. Our analysis further indicates that the tensile stress could arise from the thermal mismatch between the P(VDF-TrFE) film and the silicon substrate. Besides possible viscoelastic creep mechanism in thermoplastic P(VDF-TrFE) films, microcracks with widths in the range of tens of nanometers appeared to release the tensile residual stress.
Journal: Thin Solid Films - Volume 519, Issue 4, 1 December 2010, Pages 1441–1444