کد مقاله | کد نشریه | سال انتشار | مقاله انگلیسی | نسخه تمام متن |
---|---|---|---|---|
1674431 | 1008964 | 2008 | 5 صفحه PDF | دانلود رایگان |
عنوان انگلیسی مقاله ISI
Distributed electron cyclotron resonance plasma: A technology for large area deposition of device-quality a-Si:H at very high rate
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کلمات کلیدی
موضوعات مرتبط
مهندسی و علوم پایه
مهندسی مواد
فناوری نانو (نانو تکنولوژی)
پیش نمایش صفحه اول مقاله

چکیده انگلیسی
Distributed electron cyclotron resonance is a technique that combines low pressure, microwaves and magnetic confinement with a network of antennas to produce large area, remote, high-density plasmas in a simple reactor design. We are optimizing this promising technology for depositing intrinsic and doped a-Si:H layers for thin film solar cells. Operating in depletion mode, the growth rate is proportional to the silane flow rate and the layer quality is affected by the gas residence time, power/gas flow rate ratio, ion energy and substrate temperature. Fast deposition of device-quality hydrogenated amorphous silicon requires short gas residence time and large silane flow rate but also a well-controlled sheath potential, to induce surface re-organization without generating defects, as well as a deposition temperature larger than 250 °C. Rates up to 60 Ã
/s have been achieved, i.e. at least 5 times the industrial best. 300 nm-thick device-quality layers were produced with a minority carrier diffusion length larger than 150 nm. Using a single-point injection, we achieved an homogeneity of ± 6% (± 3 sigma) for the material bandgap, ± 10% for the dielectric function and ± 12% for the solar cell fill-factor, for an average deposition rate of 24 Ã
/s on a 20Â ÃÂ 20Â cm2 glass.
ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Thin Solid Films - Volume 516, Issue 20, 30 August 2008, Pages 6853-6857
Journal: Thin Solid Films - Volume 516, Issue 20, 30 August 2008, Pages 6853-6857
نویسندگان
P. Leempoel, P. Descamps, T. Kervyn de Meerendré, J. Charliac, P. Roca i Cabarrocas, P. Bulkin, D. Daineka, T.H. Dao, J.P. Kleider, M.E. Gueunier-Farret, C. Longeaud,